Next-Gen Pod System Platform Unveiled
A modular architecture designed for faster flavour swaps, leak-resistant airflow and scalable OEM customisation.
Leakage has always been the quiet cost of pod systems. Not the cost of the returned unit itself — that is manageable — but the cost of a retailer losing confidence in a category and quietly reducing shelf space.
Our new pod platform was designed around that single failure mode, and the architecture decisions that followed turned out to solve several other problems at the same time.
A modular approach to the pod interface
Rather than designing a device and then designing a pod to fit it, we built the interface first and let both halves develop against a fixed specification.
The result is a three-part sealing system:
- A primary silicone gasket at the fill port, compressed by the pod housing rather than by friction alone.
- A pressure-balancing channel that equalises the pod interior as altitude and temperature change during freight.
- A secondary vapour-path seal that keeps condensate away from the electrical contacts.
In transit testing across air and sea freight profiles, the combination reduced measurable leakage to under 0.3% of units — against a category baseline we typically see closer to 2–3%.
Adjustable airflow without moving the coil
Adjustable airflow usually means moving parts near the heating element, which is where reliability problems start. We moved the adjustment upstream instead.
A stepless collar at the base of the device meters intake air before it reaches the pod. Because the coil and wick stay fixed, there is no additional failure point in the thermal path, and the draw range covers tight mouth-to-lung through to a restricted direct-lung pull.
For OEM partners this matters commercially: one hardware platform can serve two distinct consumer preferences, halving the tooling investment needed to cover a market.
What OEM customisation actually covers
The platform ships with the following customisable without new tooling:
| Element | Options |
|---|---|
| Finish | Six anodised colours, Pantone matching above 50k units |
| Branding | Laser etch, pad print or in-mould labelling |
| Pod resistance | 0.6 Ω, 1.0 Ω, 1.2 Ω |
| Firmware | Wattage curve, puff limit, indicator behaviour |
| Packaging | Retail carton, counter display unit, multilingual IFU |
Anything affecting the enclosure geometry — a different silhouette, an integrated lanyard loop, a bespoke display cut-out — requires tooling, and we handle that in-house with our own CNC and EDM capability.
Availability
The platform is in volume production now, with MOQ from 1,000 units for stock configurations and from 20,000 units for fully customised enclosures.
Samples are available to qualified commercial partners. Request a sample kit with your target market and volume range, and our solutions engineering team will respond with a configuration proposal.